Overview

The Royce Physical Vapour Deposition and Characterisation Facility is a state-of-the-art facility for thin-film deposition and device fabrication. All equipment is shared and owned by the Department of Materials Science & Metallurgy and supported by expert Technical Staff associated with several groups across the Department including the DMG, CMP, WEMs and 2D Materials & Devices.

For more information click here or here to Book a CMP Royce Facility

For funding opportunities, please refer to the Henry Royce Institute website.
Current Price List

Equipment

aja.jpg	AJA Sputtering system Highly versatile RF and DC magnetron sputtering system, very good for superconducting films such as Nb Automated control of the sputtering process Ultra-high vacuum system with a base pressure better than 10⁻⁸ mbar Up to 11 target materials in one deposition Substrate size up to 100 mm diameter Substrate heater up to 850°C In-situ RF plasma pre-cleaning for substrates Quartz crystal thickness monitor Load lock allows for high throughput of samples
ufo.jpg	Custom sputtering systems The facility hosts 4 custom built DC magnetron sputtering systems Ultra-high vacuum systems up to 10⁻⁸ mbar Up to 4 different target materials Turntable with automated thickness control allows growth of multiple different samples in one deposition Sample heaters up to 1100°C is possible Reactive sputtering of nitrides and condutvie oxides is possible Highly customisable systems
e-beam_evaporator.jpg	Electron beam evaporator Can grow high purity polycrystalline metallic films such as Au, Nb, Pt, V, Al, and Cu Up to 5 targets in one deposition Can grow at room temperature or liquid nitrogen temperature Can achieve a vacuum level of 10⁻⁸ mbar Quartz crystal thickness monitor Load lock allows for high sample throughput
ion_miller.jpg	Argon ion miller The argon ion miller allows for anisotropic and non-selective etching of devices. Suitable for metallic or insulating materials.
afm.jpg	Atomic force microscope A Bruker Multimode 8 with Nanoscope 5 controller. Has several different modes of operation. Contact, tapping and peak force modes Standard atomic force microscopy (AFM) Magnetic force microscopy (MFM) Piezoelectric force microscopy (PFM) Kelvin probe force microscopy (KPFM)
ebeam.jpg	Electron-beam lithography system LEO /ZEISS 1455VP scanning electron microscope equipped with Raith Elphy Quantum for device fabrication. Accelerating voltages from 200 V to 30 kV Single writefield up to 1000 μm 250 nm feature resolution exposed using a 400 μm writefield PC-based pattern generator allow up to 63 different layers Allows fully automated or user assisted field to field alignment